Our client is a technology-oriented organisation specialising in the development, integration, and commercialisation of advanced semiconductor technologies for high-performance industrial and electronic applications. The organisation operates at the intersection of applied research, engineering innovation, and industrial technology development, supporting the transition of emerging semiconductor packaging technologies from concept and design through prototyping, validation, and practical implementation.

Its activities rely on close collaboration between multidisciplinary engineering teams, industrial partners, and research institutions, with a strong focus on technical excellence, heterogeneous integration, and next-generation microelectronics. Operating within a highly specialised innovation environment, the organisation offers the opportunity to contribute to technologically demanding projects involving advanced packaging architectures, chiplet integration, and complex semiconductor systems across multiple high-value markets.

Mission

The Packaging Engineer will be responsible for the design, development, and validation of advanced semiconductor packaging solutions, including 2.5D and 3D integration, chiplet-based architectures, and system-in-package technologies. Working within multidisciplinary engineering teams, the role will contribute to packaging development from requirements analysis and conceptual design through modelling, assembly, prototyping, and testing. The position combines packaging engineering expertise with a systems-level approach to translate innovative semiconductor integration concepts into functional prototypes and validated demonstrators.

Responsibilities

Advanced Packaging Design and Engineering

• Design and develop advanced semiconductor packaging solutions incorporating 2.5D and 3D integration, chiplet architectures, and heterogeneous systems.

• Contribute to the design of packaging structures incorporating advanced substrates, interposers, high-density interconnects, microbumps, TSVs, and emerging integration technologies.

• Analyse electrical, thermal, mechanical, and assembly requirements to support robust packaging designs and resolve technical integration challenges.

Technology Development and Prototyping

• Support packaging development activities from technical requirements and concept definition through modelling, assembly, prototype fabrication, and validation.

• Develop advanced microelectronics modules, integrated assemblies, and technology demonstrators combining different semiconductor and packaging technologies.

• Participate in laboratory prototyping, assembly, testing, and validation activities, identifying technical issues and implementing engineering improvements.

Project Execution and Technical Coordination

• Execute technical work packages in collaboration with packaging design, substrate engineering, assembly, thermal management, and validation teams.

• Support project planning and technical execution, ensuring engineering activities align with defined specifications, development milestones, and customer requirements.

• Prepare technical documentation, engineering reports, and validation results while contributing to technical reviews, risk assessments, and problem-solving activities.

Technology Development and Stakeholder Collaboration

• Contribute to the evaluation and implementation of emerging semiconductor packaging technologies and advanced integration approaches.

• Collaborate with internal engineering teams, industrial partners, and research organisations to understand technical requirements and develop effective packaging solutions.

• Support technical proposals, feasibility assessments, and collaborative R&D initiatives by providing engineering input, technical estimates, and project documentation.

Required Qualifications

• Demonstrable experience in semiconductor packaging design, assembly, or packaging technology development, ideally involving advanced 2.5D/3D integration or heterogeneous systems.

• Practical experience contributing to semiconductor packaging projects or technical work packages within multidisciplinary engineering environments.

• Good understanding of semiconductor packaging architectures, including substrates, interposers, interconnect technologies, and chiplet-based integration.

• Knowledge of the semiconductor packaging development lifecycle, including design, modelling, prototyping, assembly, testing, and validation.

• Understanding of signal integrity, power integrity, thermal management, and mechanical considerations in semiconductor package design.

• Strong analytical and problem-solving skills, with the ability to investigate technical challenges and develop practical engineering solutions.

• Good written and verbal communication skills in English, with the ability to document technical activities and collaborate effectively with multidisciplinary teams.

• Exposure to advanced packaging applications in AI, high-performance computing, RF, photonics, power electronics, automotive, or telecommunications.

• Familiarity with advanced interconnect and integration technologies, including UCIe, through-silicon vias, hybrid bonding, or high-density chiplet interfaces.

• Experience participating in collaborative industrial or academic R&D projects involving semiconductor packaging development.

• Hands-on experience supporting prototype assembly, laboratory testing, validation, and the development of functional semiconductor demonstrators.